Topological transition in coated wire medium

Thread-wire surfaces: Near-wire minimizers and topological finiteness

Alt’s thread problem asks for least-area surfaces bounding a fixed “wire” curve and a movable “thread” curve of length L. We conjecture that if the wire has finitely many maxima of curvature, then its Alt minimizers have finitely many surface components. We show that this conjecture reduces to controlling near-wire minimizers, and thus begin a three paper series to understand them. In this pape...

Localization transition in a ballistic quantum wire

H. Steinberg,1 O. M. Auslaender,1,* A. Yacoby,1 J. Qian,2 G. A. Fiete,2,3 Y. Tserkovnyak,2 B. I. Halperin,2 K. W. Baldwin,4 L. N. Pfeiffer,4 and K. W. West4 1Department of Condensed Matter Physics, Weizmann Institute of Science, Rehovot 76100, Israel 2Lyman Laboratory of Physics, Harvard University, Cambridge, Massachusetts 02138, USA 3Kavli Institute for Theoretical Physics, University of Cali...

Reentrant topological phase transitions in a disordered spinless superconducting wire

In a one-dimensional spinless p-wave superconductor with coherence length ξ, disorder induces a phase transition between a topologically nontrivial phase and a trivial insulating phase at the critical mean free path l = ξ/2. Here, we show that a multichannel spinless p-wave superconductor goes through an alternation of topologically trivial and nontrivial phases upon increasing the disorder str...

Ultra Low Loop Wire Bonding of 20 μm Palladium Coated Copper Wire for Very Thin Packages

In 1998, Carsem introduced the MLP (Micro Leadless Package). Today, the MLP has become the semiconductor industry’s package of choice for many devices with low-tomedium I/O count. Coincidentally, the MLP came out at the same time that smartphones were just starting to take off. Following the tremendous increase in market demand for smartphones, tablets and other handheld devices, the MLP soon o...

Palladium - coated and Bare Copper Wire Study for Ultra - Fine Pitch Wire Bonding